Photo by Adam Malachowski courtesy of Saras Micro Devices
Amidst the technological strides being made in Arizona, the state continues to develop its extensive network of highly specialized companies that help create the chips that the world literally runs on. According to the Greater Phoenix Economic Council, about 20 semiconductor companies have officially announced they will begin operations in Arizona, and about 20 more are in the pipeline. Such growth is necessary if Arizona’s semiconductor hub status is to reach global competitiveness.
A current inflection point for the semiconductor industry is the emerging field of advanced packaging. The increasing demand for smaller, more powerful electronic device advanced packaging goes beyond traditional methods by employing sophisticated techniques to improve performance, reduce size and integrate more functionality. Enter Saras Micro Devices. Saras stands out with a pragmatic solution to a common challenge — power efficiency.
Originally founded in Atlanta, Georgia, the company recently opened its headquarters and manufacturing operations in Chandler, Arizona, with a clear objective: to enhance power delivery for high-performance computing (HPC), artificial intelligence and advanced networking devices. At its core, Saras is tackling the power efficiency problem head-on.
As computers and AI systems become more complex, the need for more efficient power delivery grows. Saras is developing a novel solution, the Saras Tile, or STile, offering a new paradigm for in-package power delivery that significantly improves efficiency and performance while freeing up package real estate to enable higher levels of chiplet integration.
A multi-domain, substrate-embedded, passive module, STile is designed to support the growing number of power rails within the package, enabling the move of power regulation from the system board to the package. By embedding this technology directly into the substrate core of devices, Saras claims it will minimize power loss and reduce loop inductance. This integration will help improve the performance per watt — a critical metric in efficiency — which is a technical way of saying they’re aiming to make power usage more direct and less wasteful.
Its 3D structure provides a centralized, vertical power delivery solution that significantly reduces the number of separate components needed while better enabling the most advanced HPC and AI applications. The company suggests that its technology could also lead to shorter design cycles and a reduction in the three-dimensional footprint of power components, allowing these and other emerging applications to realize their full potential.
The leadership at Saras Micro Devices boasts more than 150 years of combined experience and believes in its capacity to innovate in power delivery and applications for AI and high-performance computing markets. They emphasize the need for higher power density and the role their technology could play in meeting this demand.
Saras’ decision to relocate its headquarters to Arizona was strategic. Proximity to major tech companies and a quick connection to California provide logistical advantages. With an expanding facility footprint, Saras aims to bolster its capabilities while ramping up production to meet anticipated demand. Looking ahead, Saras has outlined a product roadmap that includes its current STile technology and has a focus on modularity and versatility, allowing for development of more tailored solutions to address specific customer needs.
As Saras Micro Devices introduces its power efficiency solutions for AI and HPC markets with cautious optimism, the company has made significant investments in its Arizona facility. The company has invested $50 million into its Chandler facility, creating 50 jobs by 2025, expanding its operations and contributing to the region’s growing semiconductor industry. The Chandler site will serve as a production facility, with plans to have a pilot line operational within the year and production-ready by the following year.
The coming years will be telling as Saras moves from development to production, aiming to advance computing technology, with potential benefits ranging from improved performance to lower costs. Saras Micro Devices is ready for the industry’s growth and is strategically positioned to serve key customers in the tech industry as the ever-growing demand for higher performance, more powerful and more efficient devices drives the microelectronics industry to redefine advanced packaging.
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