As the United States strives to regain its status as a global leader in semiconductor manufacturing and research, the spotlight is now on the critical field of advanced packaging. This innovative technology involves encasing silicon chips in a protective layer to enhance their functionality and longevity. It facilitates denser chip configurations in more compact spaces and thus improves performance. This advancement is crucial for a multitude of applications, from everyday smartphones to vital defense systems.
While the U.S. has historically excelled in chip design, it has yet to catch up in the manufacturing and packaging sectors, which Asia has long dominated. One solution is this groundbreaking partnership between Arizona State University and Deca Technologies, marking the creation of North America’s first fan-out, wafer-level packaging research and development center.
This new center will be integrated within ASU’s MacroTechnology Works at the ASU Research Park in Tempe. The facility spans 250,000 square feet, with more than 40,000 square feet dedicated to state-of-the-art clean room space. It plays a crucial role in propelling forward projects under the ASU-led Southwest Advanced Prototyping Hub. Nestled in ASU’s expansive Research and Innovation Engineering College — the largest of its kind in the U.S., with more than 500 faculty members and more than 32,000 students — the center is set to spearhead a revolution in the semiconductor industry. By boosting domestic manufacturing capabilities, it aims to drive progress in critical areas such as artificial intelligence, machine learning, automotive electronics and high-performance computing.
The implications of this initiative extend well beyond the academic sphere, reaching deep into the industrial realm. It represents a strategic response to the growing demand for sophisticated semiconductor technologies, which are essential to modern life and national security. This partnership between ASU and Deca Technologies is poised to offer unprecedented access to advanced technology and expertise, setting new standards in semiconductor manufacturing.
