Amkor Technology, Inc., a leading provider of outsourced semiconductor packaging and test services, announced phase 2 of its Arizona Advanced packaging and test campus. Driven by strong customer commitments that have surpassed the 33,000 square meters of cleanroom capacity planned for phase 1, the phase 2 expansion is expected to add 60,000 square meters and bring the campus to approximately 93,000 square meters of cleanroom space. The expansion increases the project’s planned investment to approximately $12 billion.
Designed from the outset as a multi-phase project, Amkor’s Arizona campus, which includes wafer bump, probe, assembly and test capabilities, is being developed to support long-term demand for advanced semiconductor packaging and test services in the U.S. Phase 2 expands manufacturing scale, and together with phase 1 is expected to support a workforce of more than 3,500 Arizona-based employees.
“This next phase reflects the confidence our customers have placed in Amkor, the critical role advanced packaging plays in enabling the future of semiconductor innovation, and the strategic importance of our Arizona campus,” said Kevin Engel, president and chief executive officer of Amkor Technology. “As chip architectures become more complex, customers need a trusted partner that can deliver at scale with the quality, technology leadership and operational discipline required for their most advanced products, and it is critical to have that capacity in the U.S.”
Amkor’s Arizona campus is the first OSAT production site in the U.S. for advanced packaging in high volume, giving customers access to a full domestic turnkey manufacturing platform. Construction of phase 2 is anticipated to begin late 2027, with completion expected by the end of 2029. Amkor’s Arizona 170-acre campus allows for further expansion as needed to support customer demand.
