Microchip Technology announced it has engaged Macquarie Group to oversee the marketing and sale of its wafer fabrication facility (“Fab 2”) located in Tempe, Arizona. This decision is part of Microchip's previously announced manufacturing restructuring plan supporting its strategic goal of enhancing operational efficiency and profitability. The Fab 2 site, which … [More]
onsemi Proposes to Acquire Allegro MicroSystems for Nearly $7B
onsemi disclosed details on Wednesday of a proposal submitted to the Board of Directors of Allegro MicroSystems, Inc. to acquire the company for $35.10 per share in cash for each share of Allegro’s common stock on a fully diluted basis at an implied enterprise value of $6.9 billion. onsemi has made numerous attempts over the past six months to enter into constructive … [More]
U.S. to Hold Over 20% of Advanced Semiconductor Capacity by 2030, Arizona Playing Key Role
TrendForce’s latest findings reveal that Taiwan Semiconductor Manufacturing Company (TSMC) has announced it’s increasing investment in U.S. advanced semiconductor manufacturing, bringing the total to US$165 billion. Mass production is expected to begin after 2030 if the three newly planned fabs proceed on schedule. The U.S., which has been actively expanding its advanced … [More]
TSMC to Build Additional Three Fabs, Two Advanced Packaging Facilities, and R&D Center in Arizona
Following a meeting at the White House, TSMC Chairman and CEO C.C. Wei announced a historic expansion of TSMC’s advanced semiconductor operations in Arizona. TSMC will invest at least an additional $100 billion to build three additional semiconductor fabs in Arizona as well as two advanced packaging facilities and a major R&D Center. The investment comes in addition to … [More]
Semiconductor Packaging Co. to Formalizes Collaboration with ASU
LQDX Inc., developer of high-performance materials and process IP for advanced semiconductor packaging, announced that it has signed a formal agreement with Arizona State University (ASU) to further its partnership which began in 2024, focused on advanced IC-substrates, Fan Out Wafer Level Packaging (FOWLP) and glass core metallization, as enabled by its Liquid Metal Ink (LMI®) … [More]
Arizona and ASU Selected for Flagship Prototyping and Advanced Packaging R&D Facility
The Arizona Commerce Authority announced that the U.S. Commerce Department and Natcast, the operator of the National Semiconductor Technology Center (NSTC), have selected Arizona as the site of the co-located NSTC Prototyping and NAPMP Advanced Packaging Piloting Facility, the third of three CHIPS for America research and development (R&D) flagship facilities. The facility … [More]
Chipmaker to Shut Down Tempe Fabrication Facility
Microchip Technology Incorporated, a leading provider of smart, connected, and secure embedded control solutions, provided lower updated revenue guidance for the December 2024 quarter and announced manufacturing restructuring plans. This will include the shuttering of the Tempe wafer fabrication facility, referred to as Fab 2, in September 2025. "In the first two weeks of my … [More]
Intel Finalizes $7.86B Funding Award under U.S. CHIPS Act
Intel Corporation and the Biden-Harris Administration announced that the U.S. Department of Commerce and Intel have reached agreement on terms to award the company up to $7.86 billion in direct funding for its commercial semiconductor manufacturing projects under the U.S. CHIPS and Science Act. The award will support Intel’s previously announced plans to advance critical … [More]
CHIPS Incentives Award TSMC Arizona $6.6B to Secure U.S. Leadership in Advanced Semiconductor Technology
Friday, the Biden-Harris Administration announced that the U.S. Department of Commerce awarded TSMC Arizona Corporation (TSMC Arizona), a subsidiary of Taiwan Semiconductor Manufacturing Company Limited (TSMC), up to $6.6 billion in direct funding under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication Facilities. The award comes after the previously … [More]
Taiwan’s Leading Semiconductor Supplier Expands Global Reach with U.S. Facility Opening in Phoenix
Sunlit Fluo & Chemical Co. Ltd., Taiwan’s premier semiconductor chemical supplier, is expanding its international footprint with the grand opening of its first manufacturing facility outside of Asia – Sunlit Arizona, LLC. The new state-of-the-art plant, strategically located in Phoenix, Ariz., will provide critical materials to support the U.S. semiconductor industry, … [More]
Amkor and TSMC to Expand Partnership and Collaborate on Advanced Packaging in Arizona
Amkor Technology, Inc. and TSMC announced that the two companies have signed a memorandum of understanding to collaborate and bring advanced packaging and test capabilities to Arizona, further expanding the region’s semiconductor ecosystem. Amkor and TSMC have been closely collaborating to deliver high volume, leading-edge technologies for advanced packaging and testing of … [More]
Semiconductor Equipment Cleaning and Coating Facility to be Built in Mesa
Representing an over $50 million capital investment, the facility will create over 200 new jobs
KoMiCo, a global leader in precision cleaning and advanced coatings in the semiconductor industry, signed a purchase agreement to develop a state-of-the-art facility for advanced semiconductor equipment parts cleaning, coating, and repair in Mesa, Arizona. Located in the Superstition Springs area of southeast Mesa, the facility is expected to be operational by 2026, creating … [More]
$400M CHIPS Investment Preliminary Agreement to Bring 2,000 Jobs to Arizona
Proposed CHIPS investment would enable end-to-end chip production to occur in the United States while creating 2,000 jobs in Arizona
The Biden-Harris Administration announced that the U.S. Department of Commerce and Amkor Technology, Inc. have signed a non-binding preliminary memorandum of terms (PMT) to provide up to $400 million in proposed direct funding under the CHIPS and Science Act. President Biden signed the bipartisan CHIPS and Science Act, a key component of his Investing in America agenda, to … [More]
Arizona Solidifies Position as America’s Chips Hub, Will Host SEMICON West after 50 Years in San Francisco
The semiconductor conference is “North America’s premiere microelectronics exhibition”
In case you missed it, Arizona broke Silicon Valley’s “monopoly” over SEMICON West, and will host the premier microelectronics exhibition in 2025. Moving forward, the conference will be hosted in Phoenix on a rotating basis. The news comes as Maricopa County was named the best county in the US for company expansions, private investment, and jobs created. “It has never been … [More]
SEMICON West in San Francisco Puts Arizona Front and Center as the New Home of America’s Semiconductor Resurgence
Arizona’s record investments and workforce development innovations lead the nation
As SEMICON West 2024 kicks off, Arizona stands in the national spotlight as the epicenter of America’s semiconductor resurgence. Arizona leads the nation in semiconductor investment, supplier expansions and jobs. Since 2020, Arizona has won more than 40 semiconductor expansions, representing over $102 billion in capital investment and over 15,700 direct industry jobs. These … [More]
Research Initiative Advances Arizona’s Semiconductor Ecosystem by Using Sound-Based Technology
The Partnership for Economic Innovation (PEI), a passionate collective of business and community leaders dedicated to accelerating Arizona’s economic opportunities, announced Crystal Sonic, a Phoenix-based hard-technology start-up, is joining its industry-leading Applied Research Center. This public-private partnership with researchers at ASU will advance chip manufacturing … [More]
Advanced Packaging Takes Chips to the Next Level
ASU plugged into this next breakthrough in microchip tech with curriculum, partnerships with industry leaders
With Moore’s Law being stretched to its maximum, research and innovation are turning to advanced packaging to make electronics more powerful and enhance the capabilities of the tiny devices that drive the technology-based products consumers enjoy and that national defense systems rely on. Arizona State University is a key partner for the semiconductor packaging industry … [More]
TSMC Arizona Announces Plans for Third Leading-Edge Fab in Phoenix through $6.6B in Proposed CHIPS Act Funding
Third fab will produce the most advanced leading-edge semiconductors in the U.S., bringing TSMC’s total investment in Arizona to over US$65 Billion
TSMC announced that the U.S. Department of Commerce and TSMC Arizona have signed a non-binding preliminary memorandum of terms (PMT) for up to US$6.6 billion in direct funding under the CHIPS and Science Act. TSMC also announced plans to build a third fab at TSMC Arizona to meet strong customer demand leveraging the most advanced semiconductor process technology in the United … [More]
