To further strengthen economic ties between Arizona and Mexico, Arizona hosted a collaboration forum focused on semiconductor advancement on June 23-24. Held for the first time in the U.S. and Arizona, the U.S.-Mexico Semiconductor Collaboration Forum: Advancing Subnational Priorities and Strengthening Bilateral Collaboration included a welcome reception on June 23 at Phoenix … [More]
Phoenix to Host SEMICON West 2025 for the First Time, Showcasing Arizona’s Critical Role as a Semiconductor Manufacturing Hub
SEMI, the industry association serving the global semiconductor and electronics design and manufacturing supply chain, today announced strategic partnerships for this year's SEMICON® West with Alliance Sponsors Arizona Commerce Authority, Greater Phoenix Economic Council, and Visit Phoenix. These collaborations reflect a shared commitment to accelerating Arizona's semiconductor … [More]
Phoenix-Based PR Co. Named Global Semiconductor Industry Association’s Agency of Record
Kiterocket, a PR-forward communications agency, has been named agency of record by SEMI, the global industry association connecting more than 3,000 member companies and 1.5 million professionals across the semiconductor and electronics design and manufacturing supply chain. The partnership will support the association's integrated corporate communications strategy across global … [More]
onsemi Proposes to Acquire Allegro MicroSystems for Nearly $7B
onsemi disclosed details on Wednesday of a proposal submitted to the Board of Directors of Allegro MicroSystems, Inc. to acquire the company for $35.10 per share in cash for each share of Allegro’s common stock on a fully diluted basis at an implied enterprise value of $6.9 billion. onsemi has made numerous attempts over the past six months to enter into constructive … [More]
Semiconductor Packaging Co. to Formalizes Collaboration with ASU
LQDX Inc., developer of high-performance materials and process IP for advanced semiconductor packaging, announced that it has signed a formal agreement with Arizona State University (ASU) to further its partnership which began in 2024, focused on advanced IC-substrates, Fan Out Wafer Level Packaging (FOWLP) and glass core metallization, as enabled by its Liquid Metal Ink (LMI®) … [More]