Cica-Huntek Chemical Technology Taiwan Co., Ltd., a highly capable professional manufacturer of Chemical Delivery Systems (CDS) in Asia, announced today that the facilities of its U.S. subsidiary, Cica-Huntek Chemical Technology USA Corp., located in Phoenix, Arizona, have been fully completed and officially activated.
This opening is not only an important milestone for Cica-Huntek in coordinating with the global capacity layout of its core customers but also demonstrates its determination, as a core supply chain member of semiconductor facilities, to deeply root its formidable Asian technical strength and “Readiness” for real-time service capacity in North America.
To meet the urgent demand for high-end facility systems in the North American semiconductor market, Cica-Huntek’s U.S. subsidiary has invested approximately $8 million to purchase the 25,880-square-foot high-specification plant and office facilities in Phoenix. The new plant not only possesses comprehensive warehousing functions but will also further construct cleanrooms for local assembly to meet supply demands, and has already assembled an elite, localized team with rich experience in advanced processes.
“What Cica-Huntek exports to the U.S. market is not only professional core equipment but also the highest specification of management thinking that fully complies with U.S. OSHA regulations and ISO certifications,” said Watson Tseng, General Manager of Cica-Huntek’s U.S. subsidiary. “We are ready. Relying on our rich experience accumulated in advanced processes such as 2nm and advanced packaging technologies, along with our local professional team, we look forward to becoming the most reassuring and professional partner during the expansion of the high-tech industry in North America.”
“We are excited to welcome Cica-Huntek to Arizona, showcasing Arizona’s global attractiveness for semiconductor investment,” said Sandra Watson, President and CEO of the Arizona Commerce Authority. “Cica‑Huntek’s advanced facility strengthens Arizona’s growing semiconductor supply chain and reinforces the state’s leadership as a premier destination for semiconductor manufacturing, advanced technologies, and innovation.”
“By expanding the network of suppliers that support TSMC Arizona and advanced manufacturing companies, Cica-Huntek’s investment further strengthens Phoenix’s position as a global semiconductor hub,” said City of Phoenix Councilwoman Ann O’Brien, whose district includes TSMC. “As the City’s liaison to our Sister City of Taipei, I’m especially proud to welcome another outstanding Taiwanese company and celebrate the international partnerships that continue to drive opportunity and prosperity for both our communities.”
Cica-Huntek stated that as customers actively advance multi-phase wafer fab construction and advanced process mass production in Arizona, the activation of the new U.S. plant allows the team to cross time zone and geographical limitations. Maintaining a highly flexible state of “Readiness,” the company provides zero-delay engineering construction, installation, commissioning, and technical support for North American customers, utilizing the highest standards of localized service to become the most trusted partner in the North American semiconductor supply chain.
Since its establishment in 2014, Cica-Huntek has perfectly integrated over 40 years of chemical equipment development foundations from Japan’s Kanto Chemical Engineering Co., Ltd., alongside 20 years of self-developed electrical control platforms from Taiwan’s Huntek Technology. This CDS system, hailed as the “cardiovascular system of wafer fabs,” utilizes intelligent electrical controls and precision piping to ensure that high-purity chemicals achieve ultimate purity and zero error during delivery, mixing, and dilution processes, serving as a critical safety net that protects the stable operation of advanced wafer fabs.
With the full activation of the new U.S. plant, Cica-Huntek is simultaneously exporting this deeply rooted Asian technology to the North American market. Currently, the company has fully entered advanced processes below 2 nanometers and successfully supported advanced packaging fields such as CoWoS, fully assisting customers in building chip production lines in North America to meet the strict demands for high-end capacity in the AI era.
