The explosive growth of AI data centers is transforming the semiconductor industry while at the same time raising significant concerns about power consumption. As designers strive to create more powerful integrated devices that keep pace with performance demands, traditional power management architectures are starting to reveal their limitations. Embeddable passive components are in high demand, as next-generation systems require more efficient, compact and reliable power delivery within the package.
This is where Saras Micro Devices comes into play. Founded in 2021 and expanded its operations in 2023 by establishing a headquarters and manufacturing Center of Excellence in Chandler, Ariz., Saras is redefining how power is delivered to high-performance computing (HPC), AI and advanced networking applications. The company develops package-integrated power delivery solutions designed to support the next wave of growth in AI, autonomous systems, 5G/6G communications, virtual reality and cloud infrastructure.
At the center of Saras’ innovation is its STILE™ (or SarasTILE), an embeddable passive module solution that directly addresses the need for tightly integrated power delivery, capable of providing high power efficiently and enabling increased performance per watt. Unlike traditional lateral power delivery approaches, Saras’ STILE solution is uniquely positioned to address this challenge, with its ability to combine high capacitive density, 3D pass-through interconnect and design configurability to enable the transition needed for next-generation vertical power delivery architectures.
This shift marks a real change in how power is delivered at scale. For AI and HPC applications, where workloads are intensive and demand highly stable power, STILE offers a compelling alternative.
Saras manufactures its components domestically at its Chandler facility and collaborates closely with partners across the semiconductor supply chain. Its embedded passive modules are integrated directly into advanced substrates and PCBs by OSATs (outsourced semiconductor assembly and test providers), who then package the devices on behalf of top-tier IC makers working with wafer foundries.
This collaborative approach ensures Saras’ technology meets the real-world requirements of today’s chip design and manufacturing environments. The company works hand-in-hand with suppliers and end customers to tailor each STILE configuration, reducing complexity while improving system performance and integration.
Looking Forward
Saras Micro Devices is also involved in two high-impact semiconductor research projects, each awarded $100 million under the U.S. Department of Commerce CHIPS National Advanced Packaging Manufacturing Program (NAPMP). Through these efforts, led by Arizona State University and Deca Technologies for SHIELD USA, and by Absolics for SMART, Saras is helping to advance chiplet integration, improve power efficiency and bolster the domestic semiconductor supply chain.
In both projects, Saras is contributing its STILE technology as a foundational element in developing scalable, high-volume advanced packaging solutions. These collaborations are designed to support U.S. economic resilience and national security by enabling innovation in substrate materials, manufacturing equipment and heterogeneous integration.
Over the past few years, Saras secured eight foundational patents for its capacitor and STILE technologies from the United States Patent Trademark Office. This achievement underscores the company’s commitment to innovating critical solutions in power delivery for next-generation AI and HPC devices.
Saras’ work in Arizona, through its manufacturing presence, research collaborations and supply chain partnerships, anchors it firmly in the midst of one of the state’s biggest economic currents: the power demand associated with semiconductors and data centers. Arizona has become a magnet for both, and, as those projects scale, the need for more efficient power delivery only intensifies.
But this trend isn’t confined to Arizona. This common challenge is one the entire semiconductor industry around the world is grappling with. What’s happening here is a local reflection of a global issue, and Saras Micro Devices’ ecosystem grows stronger by being part of that larger conversation.
At a Glance
Company name: Saras Micro Devices
Headquarters: Chandler, Arizona
Number of employees: 50 employees overall, with 27 employees in Chandler. Chandler will be our primary growth site and we expect the number of employees to double within the next year.
Years in Arizona: Since 2023; Saras’ grand opening of its new Chandler HQ and manufacturing site was in January 2024.
Annual revenue: Saras is an emerging company and is pre-revenue.
Did you benefit from the CHIPS Act? Yes, Saras is involved with two CHIPS Act advanced substrate development projects.
What vertical(s) do you specialize in? Advanced packaging — enabling embedded in/on-package power conversion and delivery.
How do you fit into the semiconductor ecosystem? Saras Micro Devices is an integrated passive component supplier to semiconductor, package substrate and/or device packaging companies that design and manufacture the leading processors and accelerators powering AI.
Photos courtesy of Saras Micro Devices
