Arizona State University has secured up to $100 million in funding from the U.S. Department of Commerce as part of the CHIPS for America program for the SHIELD USA initiative. This initiative positions ASU as a key player in reshoring advanced microelectronics packaging to the United States, with the potential to transform the semiconductor landscape.
The grant, awarded under the National Advanced Packaging Manufacturing Program (NAPMP), will support ASU’s efforts to develop fan-out wafer-level processing (FOWLP). This cutting-edge technology allows for seamless assembly of multiple semiconductor chips, enabling faster communication, improved power efficiency and enhanced thermal management. Currently, no commercial capability for this technology exists in the U.S.
“This is a critical step for U.S. semiconductor independence, and it is the area of expertise in which we are in direct competition with China to determine who will unlock the future of innovation in semiconductor chip manufacturing,” says ASU President Michael Crow.
The SHIELD USA (Substrate-based Heterogeneous Integration Enabling Leadership Demonstration for the USA) initiative is spearheaded by Arizona State University’s Jason Conrad, program director and COO of the Southwest Advanced Prototyping Hub, and Deca Technologies’ Chief Technology Officer Craig Bishop, focuses on advancing molded core substrates.
At its core, the project will focus on four key areas:
- Accelerating Innovation: SHIELD USA will drive next-generation materials and technologies, leveraging Deca’s proven fan-out wafer-level packaging.
- Strengthening Supply Chains: The initiative will create a robust foundation for domestic semiconductor packaging, reducing reliance on overseas manufacturers.
- Expanding Workforce Development: ASU will offer tailored training programs to upskill workers and engage underserved communities, ensuring a sustainable talent pipeline.
- Enhancing U.S. Leadership: Building domestic infrastructure will secure the nation’s long-term competitiveness in microelectronics.
With participation from major industry players such as AMD, IBM, and NXP, SHIELD USA promises to create ripple effects across Arizona’s thriving semiconductor ecosystem.
