Arizona State University’s Krishnendu Chakrabarty, Ph.D., has received the prestigious SRC Innovation Award for a patent that could reshape how next-generation semiconductors are built.
The award, presented by the Semiconductor Research Corporation, recognizes patented research that makes a real-world impact. Dr. Chakrabarty’s winning design, U.S. Patent US10444279B2, introduces a new way to test 3D integrated circuits before they’re fully assembled. That means chipmakers can catch problems earlier in the process, improving both reliability and yield.
The technology centers on testing through-silicon vias (TSVs), a critical part of stacking chips vertically to make them faster and more efficient. With this architecture, companies can perform what’s called “pre-bond parametric testing.” That small change makes a significant difference when scaling up to meet the demands of AI and advanced computing.
Dr. Chakrabarty’s work has been widely recognized and adopted in the semiconductor industry, including by companies like Intel, Mentor Graphics, Samsung, TSMC, NXP and Qualcomm.
Dr. Chakrabarty, who holds the Fulton Professorship in ASU’s School of Electrical, Computer and Energy Engineering, is no stranger to big ideas. His career includes nearly 1,000 peer-reviewed papers, almost 30 books and 24 patents. His current research spans AI accelerators, hardware security, microfluidic biochips, and design-for-test solutions for complex systems.
The SRC award was presented at TECHCON, a leading semiconductor research conference. To be eligible, patents must be 5 to 15 years old, actively maintained, and tied to SRC-funded research. It’s a high bar; only a few innovations earn the honor each year.
For Arizona, it’s another sign of local talent shaping the global tech stage. And for the semiconductor industry, it’s one more reason to keep an eye on what’s happening inside ASU’s labs.
Photo courtesy of ASU
