Rogers Corporation’s Advanced Circuit Materials Division announces capital investment to increase RO3000 dielectric production capacity

Rogers Corporation May 28, 2014

Rogers Corporation, a global leader in Microwave Printed Circuit Board (PCB) Materials, announced today that it received board approval to install a RO3000® dielectric production line to increase capacity in Chandler, Arizona. Dielectric is a specialty polymeric substrate that is laminated at high temperature between two sheets of copper foil to create PCB material.

“We have decided to accelerate our investments in capacity expansion to support the strong global demand for RO3000 laminate materials, such as those used in 4G/LTE Base Station applications,” said Jeff Grudzien, vice president of Advanced Circuit Materials. “In addition, this investment puts us in a strong position to meet the future material needs of a growing number of Radio Frequency (RF) designs using RO3000 materials in 77 GHz automotive sensors and Mobile Internet Devices such as tablets and smart phones. It is an exciting time for us at Rogers, given the number of customers and applications that are seeking the advantages and unique properties that our high-frequency circuit materials provide.”

RO3000 high frequency circuit materials are ceramic-filled PTFE composites intended for use in commercial microwave and RF applications. This family of products was designed to offer exceptional electrical and mechanical stability at competitive prices. RO3000 series laminates are available without woven fiberglass reinforcement providing circuit materials with unique, electrically isotropic properties compared to competitive material offerings. In addition, RO3000 laminates are available in a wide range of dielectric constants with a low Thermal Coefficient of Dielectric Constant (TCDk) for electrical stability over a wide range of temperatures.



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